PITTSBURGH, Nov. 16, 2023 /PRNewswire/ -- Ansys (NASDAQ: ANSS) has collaborated with TSMC and Microsoft to validate a joint solution for analyzing mechanical stresses in multi-die 3D-IC systems ...

The joint solution provides a high-speed and high-capacity cloud solution for analyzing the mechanical stresses in 2.5D/3D-IC multi-die systems, which extends product reliability Ansys Mechanical is ...

Ansys has released its latest toolsuite, 2025 R2, which has many products with AI+, together with a virtual AI assistant and enhanced data management and workflow automation. The 2025 R2 suite ...