System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

Injection overmolding of unidirectional fibers and preforms is an attractive process for many good reasons. It’s fast, consistent and repeatable, and it can be performed with a machine that is ...