System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...
Rib parts (top) trialed using spring-frame molding (shown here, bottom, with curved C-channel part) and double diaphragm forming (DDF) processes in the DARPA-funded and Boeing co-funded RAPM program ...
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