Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...

As system-on-chip designs migrate to nanometer silicon, packaging technology is challenged to keep pace with the integration and performance capabilities offered. Nowhere is this more so than in ...

In today’s ever-shrinking IC package design cycles, it is almost imperative that we catch and correct routing issues as early as possible, which makes simulation an integral part of the design cycle.