This paper presents a novel 3-phase IGBT module called the SPM (Smart Power Module). This is a new design developed to provide a very compact, low cost, high perfor- mance and reliable motor drive ...
The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...
Infineon is looking to meet the power challenges of data centers as artificial intelligence (AI) becomes more important and more power-hungry. Power modules are needed to support AI accelerators, ...
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