When engineers at General Dynamics Armament and Technical Products (GDATP) recently designed the ammunition container for a new aircraft weapon system, they decided very early in the process to make ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

A key element of Mitsubishi’s new forged molding compound (FMC) carbon fiber-reinforced SMC is the use of low-flow (but not low-pressure) compression molding, which ...