Abstract: This study investigates alignment and coupling between a photonic integrated circuit (PIC) and a mixed-mode fiber array (FA), where one of the channels in the normally single-mode (SM) array ...

Abstract: Hybrid photonic integration based on flip-chip bonding combined with vertical coupling is proposed, which shows excellent alignment tolerance by simulation.

This file provides 2D and 3D masks that you can use to add edge treatments to your models. You can apply 2D masking shapes with edge_profile() to mask edges of cubes, prismoids or cylinders creating ...