Abstract: Aiming to solve high parasitic inductance, uneven thermal stress, and excessive junction temperature of power module, a novel 3D stacked packaging architecture incorporating a direct plated ...

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An incorrect DOI (10.3389/fnbot.2025.1768219) was registered for this article on publication. The correct DOI (10.3389/fnbot.2026.1768219) has now been registered. An incorrect publication date ...

Before you start the upgrade, make sure to upgrade to the latest available 3.5.x version. This will make sure that you are building against the most recent dependencies of that line. Please take time ...

4月15日消息：斯坦福大学李飞飞（Li Feifei）教授创立的空间智能初创公司WorldLabs正式发布了其最新研究成果——Spark2.0。作为一款面向Web的动态3D高斯溅射（3D Gaussian Splatting, 3DGS）渲染器，Spark2.0成功实现了与主流Web3D框架Three.js的深度集成。基于WebGL2技术栈，该 ...

Efficient Engineering: EPLAN provides software and service solutions in the fields of electrical, automation and mechatronic engineering. We develop the world's leading electrical engineering design ...